PCB microslicing resin selection reference

If the peak temperature is too high, the oxidation of copper will be affected, and the observation effect of slicing under microscope will be affected. When the powder is mixed, it will generate heat. If the temperature is too high, the viscosity will increase.  

Cold inlay material will shrink when it is solidified. At this time, there will be a gap between the mosaic and the sample. When the sample is grinded, some of the abrasives (such as the SiC particles on the sand paper) may be embedded in the gap. In the next process, the abrasive particles will be dragged out and a deep scratch on the surface of the specimen, affecting the grinding effect.  

The mixed resin has low viscosity and good mobility, which helps the resin penetrate into the micropores and the depressed area.

The operator should see the exact location of the target area through the mosaic resin. Therefore, the resin is required to have good transparency.  

After the resin powder is solidified, no bubbles are required, and the samples with bubbles are not qualified. The bubbles are black under the microscope, covering the areas that need to be detected.