Shenzhen capel technology co., LTD

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Capel will attend the 2018 Munich electronic components (FPC flexible circuit board) fair

Author: FPCissuing time:2018-11-12 11:18:08Pageviews:1779smallinBig

Shenzhen capel technology co., LTD will participate in the 2018 Munich international electronic components (FPC flexible circuit board) exhibition.
Text labels:FPC flexible circuit board

Shenzhen capel technology co. LTD
Will attend the 2018 Munich international electronic components exhibition



Munich international electronic components exhibition was first held in 1964, which is a professional trade fair of FPC flexible circuit board industry in the world. The exhibition is held every two years. Elites from all over the world gather in Munich to discuss the development of the global electronic industry and future of the electronic market in the past two years.Germany is the core of Europe and one of the largest trade centers in the world. It is also the preferred platform for Chinese enterprises to directly show their products and technologies to other countries in the world trade center.The last show a total of 2913 exhibitors in 50 countries around the world, to participate in this exhibition allows capel more direct understanding of Germany and the world of science and technology product development and market demand, improve the technology content, FPC flexible circuit board products for the production of high quality foundation, flexible circuit board products for export, capel technology improved to ensure normal export direction.


Shenzhen capel technology co., LTD. Will present at B1.280 Hall B1 with FPC , multi-layer  FPC,  special process FPC, FPC with blind and buried hole ,flex-rigid board and sincerely welcome all new and old customers to visit our booth for communication and guidance.



When: nov 13-16, 2018

Venue: new trade exhibition center, Munich, Germany

Booth location: B1.280 Hall B1

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