PCB boards generally have a thickness of 0.025-0.1um.Gold is applied to the surface treatment of PCB, and the gold has strong conductivity, good oxidation resistance and long life. The fundamental difference between the gold-plated PCB and gold-plated PCB is that gold is hard (wear-resistant) and gold is soft (non-wear-resistant).The main differences are as follows:

1. The crystal structure formed by the gold sinking of PCB circuit board is different from that of the gold plating. The gold sinking is much thicker than the gold plating.PCB heavy phase is easier to weld on the gold plating without causing poor welding.It is easier to control the stress of the alloy sheet.

2. There is nickel gold only on the solder pad of the PCB gold plate, and the signal transmission in skin effect will not affect the signal in the copper layer.The crystalline structure of PCB is more compact and less easy to oxidize than gold plating.As PCB processing precision is required to be higher and higher, the resolution of PCB line/spacing (L/S) produced by capel technology can reach 20 printed circuit m.The gold plate only has nickel gold on the pad, so it is not easy to produce short circuit wire.

3. The PCB sunk gold plate only has nickel gold on the pad, so the resistance welding on the circuit is more firmly combined with the copper layer.The project will not affect the spacing when making compensation.To demanding higher PCB board, flatness requirement is good, use heavy gold commonly, heavy gold does not appear commonly after assembling black mat phenomenon.

This is one of the reasons why few customers choose gold plating. Capel technology's gold printed PCB is widely used in medical equipment, automobile electronics, mobile communication and other fields.